Microsoft Disability Scholarship

Scholarship Sponsored by Microsoft

Overview The Seattle Foundation, together with the Disability at Microsoft Inclusion Network, funds a scholarship for current high school seniors who intend to continue their education at college or a vocational-technical program in the United States. The award supports study in specified majors and emphasizes interest in technology, leadership, and demonstrated financial need. Who may apply (Eligibility) Applicants must: - Be a current high school senior. - Plan to be enrolled full‑time or half‑time at an accredited U.S. two‑year or four‑year college/university or an accredited U.S. vocational-technical school for the coming academic year. - Be pursuing a major in one of the eligible areas: Engineering, Computer Science, Computer Information Systems, Law, Business, or related fields such as Paralegal, Pre‑Law, Finance, Business Administration, or Marketing. - Show a strong interest in technology. - Demonstrate leadership in school and/or community activities. - Have financial need to attend college. - Hold a minimum cumulative GPA of 2.5 on a 4.0 scale (or equivalent). - International students are eligible if they will enroll at a U.S. college or university. - Note: Microsoft employees and their children are not eligible. Award details - Each selected student will receive $5,000. Awards are available to students enrolled full‑time or half‑time. - Up to 11 awards will be offered. - Awards may be renewed for up to three additional years (or until the recipient earns a bachelor’s degree, whichever comes first) provided the student maintains satisfactory academic progress: a cumulative GPA of at least 2.0 on a 4.0 scale, remains enrolled full‑time or half‑time, and continues in an eligible major. - Funds apply only to undergraduate study. How recipients are chosen Selections are based on: - Academic record - Leadership and participation in school and community activities - Work experience - The applicant’s statement of educational and career goals - Any unusual personal or family circumstances - An essay (see topic below) - An online recommendation Financial need is a required consideration; applicants must demonstrate need. Scholarship America screens finalists; Microsoft makes the final recipient selections. Not all applicants will be chosen, and all decisions are final. Essay prompt Describe a new technology innovation you would propose to improve the lives of people with disabilities. Explain how it is distinct from existing solutions and how it ties into your plans to pursue work in the technology industry. (3,000 characters max) Application materials required You must upload the following documents as part of your application: - An official, complete transcript (grade reports are not accepted). Transcripts must show: student name, school name, grades, and credit hours for each course and term. - For international applicants: upper secondary school diploma/certificate (if earned) and examination results. - English translations for any documents not in English. If you are submitting SAT or ACT scores that are not included on your high school transcript, upload official score reports separately. A single online recommendation must be submitted by a faculty/staff member at your school or a community supervisor who has worked with you. That recommendation must arrive no later than three business days after the application deadline. Your application will not be considered complete until all required materials are submitted electronically. Notification timeline All applicants will be informed of the outcome in June. Notifications are sent by email. When creating your account, do not use a school or employer address; provide a personal email you will retain access to. Scholarship payment Scholarship America administers payments on behalf of The Seattle Foundation. Payments are issued in early August and are made payable to the recipient’s school; checks are mailed directly to the institution. Questions or clarifications about the program may be directed to the contact specified in the application materials.